TPS molded polystyrene sound insulation mushroom board
Mushroom nails are added to the TPS insulation board, and the heating pipes can be directly embedded in the gaps between the mushroom nails. The layout of the mushroom nails is spaced according to the specifications, and the heating pipes are fixed and laid more densely and evenly, so that the heating in the later stage is evenly heated.
19-23kg/m³
Operating temperature
≤0.035 at 23℃
density
Thermal conductivity
/
Product Introduction
Commonly used for floor heating insulation materials.
Application
"TPS molded polystyrene board floor sound insulation floating system" is a sound insulation board made of high molecular weight polystyrene board particles as the base material, which is foamed and extruded at high temperature. Its internal high-density foamed multi-aperture is specially designed to meet high requirements such as sound insulation, vibration reduction, waterproofing, mildew resistance, and heat preservation. It is suitable for various humid environments; it is a thicker sound insulation and heat preservation environmentally friendly product among similar products.
Product Performance
Sound insulation and vibration reduction
Sufficient quality and quantity
Thermal insulation performance
Long life
TPS is a multi-layer foam composite. The different pores between the multiple layers absorb different frequency bands of sound, thus showing better sound insulation and vibration reduction effects.
The thickness is measured with a standard caliper, which shows sufficient quality and quantity. It is a thicker sound insulation, heat preservation and environmentally friendly product among similar products.
The thermal conductivity is low and it has a good thermal insulation effect.
It has a long service life and is anti-aging, waterproof, mildew-proof and moisture-proof.
Technical Parameters
19~23
Volume water absorption%
≤ 10
Thermal conductivity [W/(m·K)]
≤ 0.035
Compression elastic modulus (Mpa)
≤ 0.5
Smoke toxicity
Quasi-safety ZA3 level
Compression deformation 23℃, 4kPa, 24h
Thermal load shrinkage temperature ℃
Thermal conductivity W/(m·k) Average temperature 70°C
≤0.042 ≤0.040 ≤0.040 ≤0.039 ≤0.039
A-level
Compression strength (kPa)
≥ 20