Thermosetting modified polystyrene board (Grade B1) is a new type of polymer fireproof and thermal insulation material, which was developed by Zhaosheng Polymer Technology Research Center and has developed fireproof and thermal insulation products with a grade no lower than B1: Thermosetting modified polystyrene board (Grade B1) is referred to as TPS (TPS, Thermosetting polystyrene foamed plastic thermosetting modified polystyrene).

25-50kg/m³

Operating temperature

≤0.034 at 25℃

density

Thermal conductivity

/

Because EHS boards are laid on the bottom when laying carpets on the floor of thermal, acoustic, optical, mechanical and other construction industries, home bedrooms, hotels and restaurants;

The use of floor heating system in residential buildings;

The use of soundproof soft furnishings and soundproof doors in entertainment places such as KTV. The unique properties shown have a wide range of applications in aerospace, military, transportation, communications, medicine, building materials, electricity, metallurgy and many other fields.

By using the "polymer honeycomb structure isolation chamber" technology, the polymer closed-cell foam ball material and the fireproof isolation layer have the same commonality. The two are compatible to form a unique honeycomb structure. A fireproof isolation layer is formed on the outer surface of each ball particle, so that each particle has independent fireproof ability, and then it is manufactured through foaming molding, cutting and other processes.

Low thermal conductivity, good thermal insulation performance, BI grade material, excellent fire resistance.

Low water absorption, effectively preventing moisture and mildew.

Relatively light weight and good dimensional stability.

The construction is simple, and it can be cut with a knife during installation, without any other tools.

19~23

≤ 10

Thermal conductivity [W/(m·K)]

0.035

≤ 0.5

Smoke toxicity

Quasi-safety ZA3 level

Compression deformation 23℃, 4kPa, 24h

Thermal load shrinkage temperature ℃

Thermal conductivity W/(m·k) Average temperature 70°C

≤0.042 ≤0.040 ≤0.040 ≤0.039 ≤0.039

A-level

Compression strength (kPa)

≥ 20